TSMC & Researchers Make Big Breakthrough In Chip Transistor Technology As Part Of Push Towards Developing Sub-1-nanometer Technologies
The Taiwan Semiconductor Manufacturing Company (TSMC), in partnership with the National Yang Ming Chiao Tung University (NYCU) in Taipei, Taiwan, has made a key breakthrough for next-generation transistor design. TSMC and the NYCU have demonstrated that instead of focusing on depositing new materials on the transistor channel, a better approach is to engineer the channel material to create a buffer before adding the insulating material and then the gate to control the electron flow across the transistor. TSMC & NYCU Demonstrate That Depositing Epitaxial Aluminum On Monolayer Molybdenum…
The skinny
The skinny isn't ready yet — notes appear once the transcript is processed.