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How Hardware Startups Cut Costs with Panel-Level Packaging
Panel-level packaging is quietly changing how hardware startups think about chip packaging costs. Instead of paying a premium for traditional wafer-level processes, startups are hearing about panel-level packaging as a way to cut packaging costs by up to 30 percent — but is it ready for low-volume production? In this episode, Lucas and Luna dig into the economics, the technical hurdles like warpage and die shift, and the reality for a startup shipping maybe 50,000 units a year. They look at why panel-level packaging is still mostly a high-volume play, where the sweet spot actually is, and…
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