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Xiaomi’s Xring O3 Chip Breakthrough | India News
Xiaomi’s new Xring O3 chip marks a bold leap toward tech independence as global smartphone markets grow uncertain. Built on TSMC’s cutting-edge 3nm process, it’ll power Xiaomi’s next foldable phone with initial shipments hitting 200K–300K units — directly challenging Huawei’s foldable dominance. This isn’t just about performance; it’s part of a $50B, 10-year bet to shrink reliance on external chipmakers. Their first chip, the O1, has already shipped over a million units, proving momentum. Beyond O3, Xiaomi’s also developing two more chips: the O100 neural unit for their MiMo AI model and the…
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