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Besi Shares Drop as ASML Enters Bonding Market | Markets & Money News
Besi's shares declined nearly three percent after news emerged that ASML is developing a competing hybrid bonding tool, a critical growth area for the Dutch chip equipment maker. Besi, which currently leads in die-to-wafer bonding technology, faces pressure as ASML's tool may be adopted by major clients like TSMC and Intel. Additionally, increasing competition from Korean firms and potential delays in HBM adoption could further challenge Besi's market position. The industry's rapid evolution
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