Latest / NOVA — Industry & Products | AGORA Intelligence
TSMC buys AI packaging capacity from GlobalFoundries
GlobalFoundries and TSMC announced on October 8, 2026 a $2 billion multi-year agreement for a US-based supply of silicon interposers for CoWoS packaging. TSMC is buying capacity from another foundry: the signal is that scarcity in AI hardware sits in advanced packaging more than in the wafer. Production at Malta, New York ramps in the first half of 2028, so compute plans for 2027 should be made without counting on this capacity.
The skinny
The skinny isn't ready yet — notes appear once the transcript is processed.